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INTEGRATED CIRCUITS
DATA SHEET
74AHC1G04; 74AHCT1G04 Inverter
Product specification Supersedes data of 1998 Nov 25 File under Integrated Circuits, IC06 1999 Jan 27
Philips Semiconductors
Product specification
Inverter
FEATURES * Symmetrical output impedance * High noise immunity * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V * Low power dissipation * Balanced propagation delays * Very small 5-pin package * Output capability: standard. DESCRIPTION The 74AHC1G/AHCT1G04 is a high-speed Si-gate CMOS device. The 74AHC1G/AHCT1G04 provides the inverting buffer. FUNCTION TABLE See note 1. INPUT inA L H Note 1. H = HIGH voltage level. L = LOW voltage level. ORDERING AND PACKAGE INFORMATION OUTPUT outY H L Notes
74AHC1G04; 74AHCT1G04
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns. TYPICAL SYMBOL tPHL/tPLH CI CPD PARAMETER propagation delay inA to outY input capacitance power dissipation capacitance CONDITIONS AHC1G CL = 15 pF; VCC = 5 V 3.1 1.5 notes 1 and 2; 15 CL = 50 pF; f = 1 MHz AHCT1G 3.4 1.5 16 ns pF pF UNIT
1. CPD is used to determine the dynamic power dissipation PD (W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V. 2. The condition is VI = GND to VCC. PINNING PIN 1 2 3 4 5 n.c. inA GND outY VCC SYMBOL DESCRIPTION not connected data input A ground (0 V) data output DC supply voltage
PACKAGES TYPE NUMBER 74AHC1G04GW 74AHCT1G04GW TEMPERATURE RANGE -40 to +85 C PINS 5 5 PACKAGE SC-88A SC-88A MATERIAL plastic plastic CODE SOT353 SOT353 MARKING AC CC
1999 Jan 27
2
Philips Semiconductors
Product specification
Inverter
74AHC1G04; 74AHCT1G04
handbook, halfpage
n.c. 1 inA 2 GND 3
MNA107
5 VCC
handbook, halfpage
04
4 outY
2
inA
outY
4
MNA108
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage
2
1
4
handbook, halfpage
inA
outY
MNA110
MNA109
Fig.3 IEC logic symbol.
Fig.4 Logic diagram.
1999 Jan 27
3
Philips Semiconductors
Product specification
Inverter
RECOMMENDED OPERATING CONDITIONS
74AHC1G04; 74AHCT1G04
74AHC1G SYMBOL VCC VI VO Tamb PARAMETER DC supply voltage input voltage output voltage operating ambient temperature range input rise and fall times except for Schmitt-trigger inputs see DC and AC characteristics per device VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V CONDITIONS MIN. 2.0 0 0 -40 TYP. 5.0 - - +25 MAX. 5.5 5.5 VCC +85 MIN. 4.5 0 0 -40
74AHCT1G UNIT TYP. 5.0 - - +25 MAX. 5.5 5.5 VCC +85 V V V C
tr,tf (t/f)
- -
- -
100 20
- -
- -
- 20
ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above +55 C the value of PD derates linearly with 2.5 mW/K. PARAMETER DC supply voltage input voltage range DC input diode current DC output diode current DC VCC or GND current storage temperature range power dissipation per package VI < -0.5 VO < -0.5 or VO > VCC + 0.5 V; note 1 CONDITIONS MIN. -0.5 -0.5 - - - - -65 temperature range: -40 to +85 C; note 2 - MAX. +7.0 +7.0 -20 20 25 75 +150 200 UNIT V V mA mA mA mA C mW
DC output source or sink current -0.5 V < VO < VCC + 0.5 V
1999 Jan 27
4
Philips Semiconductors
Product specification
Inverter
DC CHARACTERISTICS
74AHC1G04; 74AHCT1G04
Family 74AHC1G Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 3.0 5.5 VIL LOW-level input voltage 2.0 3.0 5.5 VOH HIGH-level output voltage; all outputs VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage; all outputs VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4 mA VI = VIH or VIL; IO = 8 mA II ICC CI input leakage current quiescent supply current input capacitance VI = VCC or GND 2.0 3.0 4.5 VOH HIGH-level output voltage 3.0 4.5 2.0 3.0 4.5 VOL LOW-level output voltage 3.0 4.5 5.5 MIN. 1.5 2.1 3.85 - - - 1.9 2.9 4.4 2.58 3.94 - - - - - - - - - - - - - - 2.0 3.0 4.5 - - 0 0 0 - - - - 1.5 +25 TYP. MAX. - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.36 0.36 0.1 1.0 10 Tamb (C) -40 to +85 MIN. 1.5 2.1 3.85 - - - 1.9 2.9 4.4 2.48 3.8 - - - - - - - - MAX. - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.44 0.44 1.0 10 10 A A pF V V V V V V UNIT
VI = VCC or GND; 5.5 IO = 0
1999 Jan 27
5
Philips Semiconductors
Product specification
Inverter
74AHC1G04; 74AHCT1G04
Family 74AHCT1G Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH VOH VOL VOL II ICC ICC HIGH-level input voltage LOW-level input voltage HIGH-level output voltage; all outputs HIGH-level output voltage LOW-level output voltage; all outputs VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -8.0 mA VI = VIH or VIL; IO = 50 A VCC (V) 4.5 to 5.5 4.5 to 5.5 4.5 4.5 4.5 4.5 5.5 5.5 5.5 MIN. 2.0 - 4.4 3.94 - - - - - - - 4.5 - 0 - - - - +25 TYP. MAX. - 0.8 - - 0.1 0.36 0.1 1.0 1.35 Tamb (C) -40 to +85 MIN. 2.0 - 4.4 3.8 - - - - - MAX. - 0.8 - - 0.1 0.44 1.0 10 1.5 V V V V V V A A mA UNIT
LOW-level output voltage VI = VIH or VIL; IO = 8 mA input leakage current quiescent supply current additional quiescent supply current per input pin input capacitance VI = VIH or VIL VI = VCC or GND; IO = 0 VI = 3.4 V other inputs at VCC or GND; IO = 0
CI
-
1.5
10
-
10
pF
1999 Jan 27
6
Philips Semiconductors
Product specification
Inverter
AC CHARACTERISTICS Type 74AHC1G04 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH tPHL/tPLH tPHL/tPLH tPHL/tPLH Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. Type 74AHCT1G04 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS tPHL/tPLH tPHL/tPLH Note 1. Typical values at VCC = 5.0 V. propagation delay inA to outY propagation delay inA to outY see Figs 5 and 6 see Figs 5 and 6 CL 15 pF 50 pF VCC (V) 4.5 to 5.5 4.5 to 5.5 propagation delay inA to outY propagation delay inA to outY propagation delay inA to outY propagation delay inA to outY see Figs 5 and 6 see Figs 5 and 6 see Figs 5 and 6 see Figs 5 and 6 CL 15 pF 50 pF 15 pF 50 pF VCC (V) 3.0 to 3.6 3.0 to 3.6 4.5 to 5.5 4.5 to 5.5
74AHC1G04; 74AHCT1G04
Tamb (C) +25 MIN. - - - - TYP. 4.3(1) 6.1(1) 3.1(2) 4.5(2) -40 to +85 MAX. MIN. MAX. 8.9 11.4 5.5 7.5 1.0 1.0 1.0 1.0 10.5 13 6.5 8.5 ns ns ns ns UNIT
Tamb (C) +25 MIN. - - TYP. 3.4(1) 4.9(1) MAX. 6.7 7.7 -40 to +85 MIN. 1.0 1.0 MAX. 7.5 8.5 ns ns UNIT
1999 Jan 27
7
Philips Semiconductors
Product specification
Inverter
AC WAVEFORMS
74AHC1G04; 74AHCT1G04
handbook, halfpage
inA input
VM(1)
handbook, halfpage
VCC VI D.U.T. RT CL
MNA101
tPHL
tPLH
PULSE GENERATOR
VO
outY output
VM(1)
MNA111
FAMILY AHC1G AHCT1G Fig.5
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM INPUT 1.5 V
VM OUTPUT 50% VCC
Definitions for test circuit: CL = Load capacitance including jig and probe capacitance (see Chapter "AC characteristics"). RT = Termination resistance should be equal to the output impedance Z0 of the pulse generator.
50% VCC 50% VCC
The input (inA) to output (outY) propagation delays.
Fig.6 Load circuitry for switching times.
1999 Jan 27
8
Philips Semiconductors
Product specification
Inverter
PACKAGE OUTLINE Plastic surface mounted package; 5 leads
74AHC1G04; 74AHCT1G04
SOT353
D
B
E
A
X
y
HE
vMA
5
4
Q
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E (2) 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT353
REFERENCES IEC JEDEC EIAJ SC-88A
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
1999 Jan 27
9
Philips Semiconductors
Product specification
Inverter
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
74AHC1G04; 74AHCT1G04
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Jan 27
10
Philips Semiconductors
Product specification
Inverter
74AHC1G04; 74AHCT1G04
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable REFLOW(1)
1999 Jan 27
11
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
SCA61
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/00/02/pp12
Date of release: 1999 Jan 27
Document order number:
9397 750 04943

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